To support the latest wafer processes involving increased density, multiple layers, and progressively higher steps, this type enables various macro inspection functions including transport (micro inspection), pattern-side macro inspection, back-side center and periphery macro inspections. Users can select from three models—TMB, TM, and T—according to their needs. These models offer a variety of features, including non-contact centering controlled by photoelectric sensor to prevent contamination; a large, easy-to-read LCD control panel; and high throughput made possible by a multi-arm system that simplifies wafer loading and unloading; and support for both 150mm and 200mmø wafers.
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