Ultrahigh-precision Type with Maximum Magnification Module NEXIV VMR-H3030 Z120X
With an ultrahigh-precision stage and maximum magnification module, it measures fine workpieces with ultrahigh accuracy (e.g., critical dimensions on patterned masks and bump heights)
Applications
Wafer level CSP
Wafer level bump heights
Wafer level SIP
Rerouted masks
Masks for MEMS
- 120X optical magnification enables measurements of rerouted patterns on wafer level CSP
- High precision stage facilitates accurate measurements even for wider dimensions
- Enables measurements of top and bottom widths of etched lines, respectively
- Laser AF facilitates measurements of minuscule bump heights
- Enables evaluation of cross-sectional shapes of bumps and solder balls
