Wafer Edge Bevel Inspection System WES-3000

“High-speed wafer edge monitoring suitable for a mass-production process” and “Clear color with high resolution defect review” are all in one WES-3000.

Major Features

• High Speed Inspection
  The WES-3000 achieves an industry-leading throughput of 100 WPH*.
  *Inspection on whole 360 degrees covering Upper Bevel, Apex and Lower Bevel of a wafer edge.
• High Stability Hardware with High Performance
  High-speed and stable inspection with image capturing is always available thanks to the high precision alignment wafer stage system.
• High Sensitivity
  The WES-3000 enables defect detection with a resolution of 4μm while maintaining high-speed inspection.
• Wide Inspection Area
  High-speed inspection covers 5mm from wafer edge.
• High Resolution Review Image
  Defects detected by high-speed inspection can be reviewed by clear color with high resolution review with 1μm resolution.
• User-Friendly Operation
  The WES-3000 control panel and GUI enable simple and intuitive operation.
• Various Applications and Functions
  Various applications and functions support classification and analysis on detected defects.
  The WES-3000 contributes to improve process yield through the early detection and identification of wafer edge defects.