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Nikon Group exhibits its major products listed below at Nikon Booth (3C-1101) in Hall 3 with the theme of "Integrated Solution for the Future."
Fuji Bldg., 2-3 Marunouchi 3-chome, Chiyoda-ku, Tokyo, 100-8331
Sales Headquarter, 1st Sales Department +81-3-3216-1005/1006/1346
Sales Headquarter, 2nd Sales Department +81-3-3216-1008
The NSR-S610C is the world's first ArF immersion scanner to achieve the ultra-high NA of 1.30. The equipment ensures enhanced alignment accuracy and high throughput thanks to Nikon's original tandem stage design and local fill nozzle that constitutes one of the essential elements in immersion lithography technology while eliminating possible defects due to immersion even in the topcoat-less resist approach. This machine accommodates volume production of the most advanced devices with resolutions of 40 to 45 nm and already has a proven track record of producing results in our customers' production lines.
The NSR-S609B boasts of the world's first ArF immersion scanner to break through the NA of 1.0 thanks to Nikon's proprietary immersion lithography technology. The equipment incorporates an ultra-high performance projection lens that provides NA of 1.07 and also adopts Nikon's original tandem stage design, which contributes to attain further enhanced throughput and enable production of the most advanced devices with resolution of 55 nm or less.
The NSR-S310F ArF scanner incorporates the tandem stage already proven in the practical application of immersion lithography technology to further enhance throughput and alignment accuracy, and improve productivity by 20% over conventional models. Also it employs the high-performance projection optics offering an ultra-high NA of 0.92 to suit volume production of devices with resolution of 65 nm or less and greatly reduce CoO (Cost of Ownership).
The NSR-S210D KrF scanner features the high-performance projection optics offering a high NA of 0.82 to accommodate volume production of devices with resolution of 110 nm or less. It incorporates the tandem stage already proven in the practical application in the immersion lithography equipment to ensure higher throughput and greater alignment accuracy, providing improved productivity by 20% over conventional models.
The NSR-SF155 is an i-line all-in-one scan field stepper designed with an innovative platform best suited for steppers, Skyhook Technology and light-weight wafer stage to achieve substantially reduced vibration and fastest possible stage movement. The equipment boasts of an ultra-high throughput of 200 or more wafers per hour (for 300 mm wafers). This system also provides the flexibility of being able to upgrade from SF150 to SF155 in our customers' production lines.
Nikon has succeeded in developing a new overlay solution "Total Overlay Accuracy Improvement System 'Scanner Match Maker (SMM)'" in cooperation with KLA-Tencor Corporation. The system features automated operation for both system data management and overlay accuracy improvement, which are essential for the vast number of overlay processing.
Total Output refers to the high-level integration of Throughput (equipment processing speed), Yield (equipment productivity) and Uptime (equipment reliability), which is achieved based on Nikon's thorough technological efforts starting from our original lens design and manufacturing. Based on the concept of Total Output, Nikon has been developing advanced IC Steppers and Scanners aimed at further improved productivity in the exposure processes. In this booth, Nikon exhibits our Total Output achieved up to date.
8, Higashida-cho, Kawasaki-ku, Kawasaki, Kanagawa, 210-0005, Japan
3rd Sales Section, Sales Department, Industrial Instruments Division +81-44-223-2170
AMI-3400 is configured with the PER (Pattern Edge Roughness) optical system featuring overwhelming superiority in the 45 nm-node processes.
It allows for high-speed full surface inspection for wafer, achieving a remarkable throughput (160 wafers per hour). The new development of various application software aids substantial reduction in the possibility of increased man-hours needed for optimized processes, thereby contributing to the improvement of the processes.
The optical microscope is configured with the PER (Pattern Edge Roughness) optical system acclaimed for the high performance in the practical application with AMI (Automatic Macro Inspection System).
The equipment offers high sensitivity comparable to that of SEM (scanning electron microscope) while achieving extraordinary capture ratio. Nikon will continue to contribute to improved operational processes by developing a variety of application software for significant suppression of possible increase in man-hours needed to optimize the processes.
In keeping up with the trend toward finer design rules and resultant increasing importance of inspection of wafer edge/beveling angle, Nikon has just developed an edge inspection system configured with Nikon's proprietary optics to allow viewing of images at dramatically enhanced resolution.
Nikon will continue to contribute to improved operational processes by developing a variety of application software for significant suppression of possible increase in man-hours needed to optimize the processes.
5-21, Katsushima 1-chome, Shinagawa-ku, Tokyo, 140-0012, Japan
+81-3-5762-8966/8977
8, Higashida-cho, Kawasaki-ku, Kawasaki, Kanagawa, 210-0005, Japan
+81-44-223-2174 +81-44-223-2178
This is a groundbreaking video measuring system developed based on the strength of Nikon's opto-mechatronics technologies. It allows fast and high-precision assessment of three-dimensional geometric measurements on the most advanced packages as well as two-dimensional and height measurements in the same field of view.
The NWL200 series is designed with Nikon's proprietary wafer transfer mode for wafers of 125 to 200 mm in size. The single equipment allows transfer of three different sizes of wafers (optional). This series offers the capability of inspecting ultra low-profile wafers of 600μm to 100μm in thickness to meet the market needs (optional). It is also equipped with the capabilities to inspect edge chipping and wafer edge defect after back grinding which have become the challenges to be solved in the production processes in the trend toward increasingly finer design rules.
3-3 Minatomirai 2-chome, Nishi-ku, Yokohama, Kanagawa, 220-6116, Japan
Development Planning Department 1st System Division +81-45-682-0145
PPDS III is Nikon's latest recipe management system compatible with NSR-2205i11 and later NSR systems.
The RCS-Link is a new RCS system with LAN interface to support the latest models of NSR