Ground-breaking multi-functional video measuring system, was developed on the strength of Nikon's leading opto-mechatronics technologies.
Incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.
The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages, such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
- Simultaneous wide-area height measurements with Nikon proprietary confocal optics
- 2D measurement with 15x brightfield zoom optics
- Fully compatible with 300mm wafer measurement at semiconductor fabs
- IC Packages
- Flip Chip/COF(Bump)/COG
- CSP (FBGA)/SIP (Bump, Wire)
- Interposer (Pad height)
- Probe Card (Silicon Probe, Au Probe)
- Precise Glass Components (Micro Lens, Contact Lens)
- Photo Spacer Width/Height for Color Filter for FPD Panel