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IC Chips / Electronics
Covering lithography systems for producing semiconductors and high-definition FPDs, as well as measuring systems for a variety of electronic components. Also includes various optical glass and optical materials.
For producing panels employed by large-sized TVs and high-definition smart devices
For producing semiconductors employed by cutting-edge processors/memories
From additive manufacturing as a 3D printer, to laser marking and welding
Realizes high-speed, highly accurate wafer measurement for greatly improved lithography accuracy
For measuring sizes/shapes of precision parts
Automated video measurement of sizes/shapes of precision parts
Accurate sub-nano-surface profiler with non-contact measurement
For non-contact, highly accurate, 3D measurement
For measuring internal/external dimensions without disassembling the product
Versatile observation with high optical performance
Automatic macro/exterior inspection of IC wafers, Illumination for Imaging Sensor Inspection
Indication of thickness/differences of parts in units of 0.01µm
Sensors capable of detecting absolute rotational displacement values
Optical components (light source, projection lens, etc.) and materials (synthetic silica glass, calcium fluoride, etc.)