Nikon Introduces the X-ray CT system “XT H 225 ST 2x”

New innovative features drive double productivity and enhanced inspection

March 16, 2021

XT H 225 ST 2x

TOKYO - Nikon Corporation (Nikon) is pleased to announce the release of the 225kV, microfocus X-ray CT (Computed Tomography) system, the “XT H 225 ST 2x”.

Exceptional improvements have been made by Nikon in its new “XT H 225 ST 2x”. Two of the features are not to be found on any other industrial CT system. One is “Rotating.Target 2.0”, which thanks to more efficient cooling enables a 3x smaller focal spot size for clearer imaging. The other, “Half.Turn CT”, is a novel method for almost halving the angle through which a specimen rotates during the X-ray cycle, speeding the process without loss of image quality.

The operation has been greatly simplified and efficiency doubled, enhancing the system's suitability for a wide range of applications from the museum laboratory through academia to the R&D department and on to the factory floor.

“XT H 225 ST 2x” allows both the exterior and interior of a sample to be inspected and measured non-destructively. Being able to detect inside of the components which cannot be seen is necessary for quality control, failure analysis, and material research. Nikon offers a wide range of high-resolution X-ray CT inspection systems with unique microfocus X-ray source technology.

Product Information

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Product Name Microfocus X-ray CT system “XT H 225 ST 2x”
Availability From March 16, 2021

Product Development Background

With the increase in electronic and semiconductor parts mounted on products for the automobile industry as well as the spread of 3D printers, the number of products molded by various methods has also been increasing.
Manufacturers in various industries, such as automobiles, electronic components, molds, and batteries, are required to inspect the components internally and non-destructively in the manufacturing process.
To meet these demands, Nikon has developed the “XT H 225 ST 2x”, simplifying the operation and speeding the process without loss of image quality.

Key Features

1. Continuous generation of high power X-rays with a small focal spot size

“Rotating.Target 2.0” maximizes the quality of data collected and hence image resolution. Spinning the target dissipates the heat generated by the small focal spot size more efficiently, enabling continuous generation of high power X-rays and a dramatic increase in scanning speed and resolution, without the need for cool-down.
It also doubles the running time before preventive maintenance is required, lowering costs and raising equipment availability.

2. Improvement of measurement accuracy by automated calibration of voxel* size

“Local.Calibration” allows rapid, repeatable, automated calibration of voxel size at any CT scan position, rather than the user having to perform the function manually. It leads to a radical improvement in measurement accuracy. Extra benefits are that the procedure is deskilled and dimensional accuracy is traceable.

  • *Unit which divides the point in 3D space into a cubic lattice

3. Improvement of filament lifetime and system uptime by “Auto.Filament Control”

“Auto.Filament Control” intelligently controls the X-ray source to double the lifetime of the filament, lowering the cost and increasing system uptime without losing microfocus resolution.
Also, downtime is considerably reduced by the introduction of “Quick.Change” plug-and-play filament cups. It used to require adjusting the position each time the filament was replaced. With the filament cups placed and adjusted in advance, the replacement time can be considerably reduced.

4. Increase inspection efficiency by “Half.Turn CT”

Instead of rotating the sample under investigation through 360 degrees during the X-ray cycle, with “Half.Turn CT”, it is only necessary to rotate it through just over 180 degrees to obtain sufficient data for an image of equivalent quality. Increasing data acquisition rate by 100 percent doubles inspection efficiency, which is especially useful in support of production applications. There will be an artefact (the noise) when investigating in less than 1 rotation, however, this can be reduced by Nikon’s optimized reconstruction software.

Main Specifications

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X-ray Source
Maximum Energy
225 kV Reflection Target (Standard)
180 kV Transmission Target (Option)
225 kV Rotating Reflection Target (Option)
X-ray Source
Maximum Power
225 W (225 kV Reflection Target type)
20 W (180 kV Transmission Target type)
450 W (225 kV Rotating Reflection Target type)
Detector FPD (Maximum active area 432 mm x 432 mm)
Manipulator (Standard) 6 axes
Maximum Sample Weight 50 kg
Maximum CT
Swept Diameter
⌀255 mm
*Depends on the size of the detector
Cabinet Dimensions
(W x D x H)
2,414 x 1,275 x 2,202 mm
Weight (approx.) 4,200 kg

The information is current as of the date of publication. It is subject to change without notice.