Nikon Introduces New Confocal NEXIV, VMZ-K6555
March 23, 2009
Nikon Corporation (Michio Kariya, President) is pleased to announce the launch of the new Confocal NEXIV VMZ-K6555. The new Confocal NEXIV VMZ-K6555 is designed for faster and more accurate non-contact 3D measurements on larger size substrates, probe cards, and other applications requiring large stage travel. Higher magnification optics is incorporated in the design of the new Confocal NEXIV VMZ-K6555.
|Product name||Confocal NEXIV, VMZ-K6555|
|Start receiving orders from||March 30, 2009|
The new Confocal NEXIV VMZ-K6555 has been designed with longer XY travel (650x550 mm) to cover the non contact 3D measurement requirements of larger substrates such as recent cutting-edge interposer substrates, and probe cards with greater accuracy and faster measurement speed. In addition, the new Confocal NEXIV VMZ-K6555 optical head employing the newly designed higher magnification objective lens (30x) can be configured for better resolution power along the XY plane.
Similar to the current Confocal NEXIV VMR-K3040ZC, the new Confocal NEXIV VMZ-K6555 continues to allow for both 2D measurements on brightfield images with a CNC 15x zooming optics and 3D measurements on confocal images. Furthermore, TTL scanning laser automatic focus and Video image automatic focus functionalities have been added to the new Confocal NEXIV VMZ-K6555 for more flexibility.
For faster measurement speed, the standard confocal optics using lower magnifications such as 1.5x, 3x and 7.5x has been redesigned and employed. The system can be configured either with built-in high magnification CF optical head or with built-in standard magnification CF optical head so that it can be optimized for broad variations of complicated and smaller measuring targets on any measuring application.
1. Longer XY stage strokes
650x550 mm strokes are realized for the inspection of 510 mm square interposer substrates or 500 mm diameter probe cards or any application requiring large XY stage travel.
2. High magnification lens 30x and high magnification CF optical head (Type H)
The dedicated 30x objective lens and high magnification CF optical head have been newly designed to produce higher resolution for the measurements of smaller line width and spacing.
3. Optional standard CF optical head (Type S)
Dedicated objective lenses such as 1.5x, 3x and 7.5x are used with a wider field of view for the standard CF optical head for faster measurement speed.
4. TTL scanning laser AF and vision AF now available on the VMZ-K6555
The renowned NEXIV automatic focusing capabilities have now been added to the new Confocal NEXIV VMZ-K6555 for the ability to easily accomplish much more complex measuring applications.
5. Higher resolution power and higher traveling accuracy on the Z axis
Z axis travel resolution is now 0.01 µm and traveling accuracy on the Z axis is now 1+L/150 µm1+L/1000 µm, regardless of the type of confocal optical head.
(Revised on March 24, 2009)
6. LED light source
For episcopic and diascopic lighting, the halogen light source has been replaced with LED light allowing for longer life and brighter images.
|Head Type||Type H||Type S|
|W.D.||5 mm||5 mm||24 mm||24 mm|
|Confocal Optics for Area Height Measurement|
|Maximum scanning range||1 mm||1 mm||1 mm||1 mm|
|Field of view||0.4x0.3 mm||1.6x1.2 mm||4x3 mm||8x6 mm|
|Z measurement repeatability (2σ)||0.2 µm||0.25 µm||0.35 µm||0.6 µm|
|Z axis minimum read out||0.01 µm|
|Height measurement speed||1.5 sec./FOV|
|Brightfield Optics for 2D Measurement|
|Zooming method||Motorized 5-step zoom (1-15x)|
|Field of view||0.39x 0.3-0.049x 0.037 mm||1.6x 1.2-0.11x 0.08 mm||4x3-0.27x 0.2 mm||8x6-0.53x 0.4 mm|
|Light source||White LED|
|Auto focus||TTL Laser AF/Vision AF|
|Stroke (X x Y x Z)||650x550x150 mm|
|Guaranteed loading capacity||30 kg|
|XY traveling accuracy U1X/Y||1.5+2.5L/1000 µm|
|Z axis||(begin delete)
|Main unit weight||(begin delete)
|Power source/ consumption||AC 100-240 V ± 10 % 50/60 Hz / 10 A - 5 A|
|Operating conditions||Temperature: 20 °C ± 0.5 K
Humidity: 70 % or less
|Acquired standard||CE marking (low voltage/EMC/Laser)|
- *Revised on March 24, 2009
The information is current as of the date of publication. It is subject to change without notice.